How Does Custom Board Level Shielding Utilize Photo Chemical Machining

Medical, electronic, and microelectronic companies and organizations are bound to require etched metal electromagnetic interference (EMI) and radio frequency (RF) shields at some point to provide suitable protection to their components and products from all sorts of environmental, electromagnetic, and radiation hazards. Electrical grounding is also a critical factor in the manufacturing process, and for this reason, it is a mistake to ignore the importance of board level shielding. The solution is to approach a company that has experience and expertise in the field and can provide both custom and standard board level shielding to meet the design specifications of the clients. Extensive etching and innovative technological capabilities will enable them to manufacture easy-to-use and reliable shielding solutions using a wide range of materials at cost-effective prices.

Why is Board Level Shielding a Priority?

Radio frequency interference (RFI) and EMI from external sources are capable of interfering with, interrupting, or severely hampering the output and performance of a printed circuit board as well as its various components. RF and EMI tend to affect the reception of radios and television sets, cell phones, medical devices, consumer products, and industrial and military gadgets. The primary sources of RFI and EMI include different types of common household appliances, switched-mode power supplies, radio transmitters, and integrated circuits. It is not always necessary for the conductors to have any sort of physical contact with the active component; interference may be inducted via remote transmissions, and so just being in close proximity is enough to harm the electronic gadgets. Irrespective of what measures you adopt, your equipment is at a constant risk unless the inside parts of the integrated circuits have been properly shielded from RFI and EMI.

Significance of Photo Chemical Machining

Some manufacturers offer both regular and custom forming tools in a wide range of shapes and sizes to meet the requirements of the customers. They offer quotes on existing etched metal shields with removable covers, and incorporate custom part numbers, bend lines, as well as logos into the new design. Even if the design is complex and intricate in nature, it is best to use a photo tool for that purpose. The use of photo tools manages to improve the ease of executing subtle changes to the designs while decreasing the price of the end product as well as the delivery times for production parts and prototypes.

How Does Photo Chemical Machining Work?

Board level shielding options include a one-piece or two-piece construction.  The standard base materials are brass, tin-plated brass, nickel, copper, tin-lead, stainless steel, tin, and cold-rolled steel. All of these materials offer solderable plating choices and may be flat or formed. The finishing can be done in a variety of options, including bright nickel, tin-lead, tin, nickel, gold, and palladium nickel. Sometimes, nickel alloy is used as the base material as it has no need for any additional finishing due to its already solderable nature. For competent cooling processes, the presence of arrayed etched slots, holes or patterns are necessary along with multi or single cavity designs in any size.

How to Cut Costs?

A standard one-piece shield will be the simplest and the most cost-effective form of shielding available in the industry with through-hole or surface-mount construction. The sizes can be altered to fit tight corners, and it is possible to hand-fold the shield as per the requirements of the customer. They enjoy complete flexibility and can change or add anything on the shield to conform to their needs with minimal expenses. Part numbers or logos may be etched onto the surface for further customization of the shield.

The application for board level shielding through photo chemical machining are numerous. They can be used in almost any industry where the board components need to be protected from EMI and RF shielding.


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